X-ray technology provides insight into the inside of parts without destroying them. As a result, not only hidden defects become visible, but internal structures can also be measured. With only one scan, you can obtain a multitude of information regarding defects, dimensional accuracy and material properties, and thus the possibility to fully assess the quality. This eliminates the need for time-consuming and cost-intensive tests with several other inspection and measuring methods. In addition, thanks to 3D CT technology, components can be reproduced even if CAD is not available.
Would you also like to benefit from the advantages of X-ray technology? Nothing easier than that with the ZEISS X-Ray Series. Depending on your demands, such as precise measurements of small plastic parts, fast defect analyses of aluminium castings or high-resolution material analyses of 3D manufactured parts, we can offer you a complete solution from a single source. Customers benefit from an extremely broad hardware portfolio, ranging from easy-to-use systems for every customer need, high-precision computed tomography (CT) systems, robust, automated systems for production, to high-resolution X-ray microscopes.
The software and accessory solutions as well as extensive services complete the picture. In this way, the customer receives an individual overall solution from one source.
In addition to the metrologically specified ZEISS METROTOM product family, ZEISS is the only supplier that can cover high-resolution analysis applications with 3D X-ray microscopes – and recently even metrological applications. The metrology option for ZEISS Xradia Versa systems is specified to a measuring accuracy (MPE) of (1.9 + L/100) μm in terms of probing deviation – one of the lowest currently available on the market for CT metrology. This allows high-resolution metrological evaluations to be carried out in a field of view of 5 mm. This is important, for example, for the qualification of the smallest electronic components or parts that require extremely low tolerances.
In order to make this possible, ZEISS has developed MTC Nano, a new length measurement standard in accordance with the relevant VDI/VDE 2617-13 and 2630-1.3 guidelines - a calibration standard that is so precise that it can only be traceably measured at two locations in the world. This is an ideal solution for users who are used to high accuracy from their tactile measuring devices and expect the same from CTs.
X-ray solutions are used not only in the measuring room, but also directly in production. The robust X-ray solutions of the BOSELLO product families allow very fast 2D inspection in production. If the dimensional accuracy of parts has to be carried out automatically or the exact dimensions and location of defects have to be determined, 3D computer tomography systems of the ZEISS VoluMax family are the right choice. Parts are automatically inspected and evaluated for defects and, if necessary, sorted out before high costs for processing of the defective part accumulate.
For reliable quality assurance, ZEISS already has high-performance software in its portfolio, such as ZEISS CALYPSO and ZEISS Automated Defect Detection. With GOM Inspect, a proven software solution for metrological evaluation is now part of the ZEISS X-Ray Series. This gives ZEISS customers everything they need for their inspection and measurement tasks from a single source. This makes it possible to provide the customer with the best overall solution for their application, rather than a single product.
Another benefit for customers is the global ZEISS service network, which ensures that their X-ray solutions always work, with a uniform international service standard. This also includes training and education to ensure consistent quality in handling inspection and measurement tasks at all customer locations. This allows industrial customers to concentrate fully on production with the reassuring security that comes with the total insight of a ZEISS X-Ray solution.